| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 30202 | BOSCH/博世 | DIP-20 | 2000 | 19300 | 2026-04-04 | |||
| UPD78F0501MC(T)-5A4-A | NEC/日电电子 | TSSOP30 | 2007 | 18575 | 2026-04-04 | |||
| U842B-MFPG3 | TFK | SOP | 2001 | 124000 | 2026-04-04 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UPD78F0501MC(T)-5A4-A | NEC/日电电子 | TSSOP30 | 2007 | 18575 | 2026-04-04 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAXM17532AMB+ | MAXIM/美信 | QFN | 1846 | 674 | 2026-04-12 | |||
| XC95144XL-7TQ144C | XILINX/赛灵思 | LQFP | 02+ | 150 | 2026-04-12 | |||
| UPD75P117HGC-AB8 | NEC/日电电子 | QFP | 97 | 980 | 2026-04-12 | |||
| UPD78F0513AGA-GAM-AX | RENESAS/瑞萨 | QFP-8 | 17 | 450 | 2026-04-12 | |||
| C8051F321-GMR | SILICON | QFN | 19 | 700 | 2026-04-12 | |||
| R5F21276SDFP#V2 | RENESAS/瑞萨 | QFP32 | 22 | 650 | 2026-04-12 | |||
| UPD70F3572GBA1-GAH-AX | RENESAS/瑞萨 | QFP64 | 22 | 2500 | 2026-04-12 | |||
| UPD78F0515AGA-GAM-AX | RENESAS/瑞萨 | QFP48 | 16 | 600 | 2026-04-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| S29GL128S90DHI010 | SPANSION/飞索半导体 | BGA | 18 | 1050 | 2026-04-12 | |||
| UPD784031GC-8BT-A | RENESAS/瑞萨 | QFP | 12 | 500 | 2026-04-12 | |||
| 5M240ZT144C4N | ALTERA/阿尔特拉 | QFN | 15 | 118 | 2026-04-12 | |||
| EPM3064ATC100-7N | ALTERA/阿尔特拉 | QFP | 17 | 53 | 2026-04-12 | |||
| EP1C20F400C8N | ALTERA/阿尔特拉 | QFP | 14 | 49 | 2026-04-12 | |||
| EPF6024AQC208-3N | ALTERA/阿尔特拉 | QFP | 16 | 288 | 2026-04-12 | |||
| S29GL256S90DHI020 | SPANSION/飞索半导体 | SOP | 13 | 100 | 2026-04-12 | |||
| KSZ8795CLXCC | MICROCHIP/微芯 | LQFP | 16 | 80 | 2026-04-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UPD78F0513AGA-GAM-AX | RENESAS/瑞萨 | QFP-8 | 17 | 450 | 2026-04-12 | |||
| R7F7010233AFP | RENESAS/瑞萨 | QFP | 20 | 10188 | 2026-04-12 | |||
| R5F10PPJLFB | RENESAS/瑞萨 | QFP | 20 | 7568 | 2026-04-12 | |||
| UPD70F3529GMA9-GBK-Q-G | RENESAS/瑞萨 | LQFP | 22 | 320 | 2026-04-12 | |||
| DF2215RUTE24V | RENESAS/瑞萨 | QFP | 18 | 78 | 2026-04-12 | |||
| S29JL064H70TFI000H | SPANSION/飞索半导体 | TSSOP | 11 | 960 | 2026-04-12 | |||
| MSP430F5310IZQE | TI/德州仪器 | BGA | 12 | 3 | 2026-04-12 | |||
| M62490FP | RENESAS/瑞萨 | SSOP36 | 2006 | 1000 | 2026-04-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| HD6413002F16V | RENESAS/瑞萨 | QFP | 14 | 720 | 2026-04-12 | |||
| HD6417706F120DV | RENESAS/瑞萨 | QFP | 12 | 276 | 2026-04-12 | |||
| UPD71051GB-3B4 | NEC/日电电子 | QFP | 06 | 740 | 2026-04-12 | |||
| HD64F2357F20V | RENESAS/瑞萨 | QFP | 13 | 104 | 2026-04-12 | |||
| MT48LC16M16A2-75 | MICRON/美光 | QFP | 09 | 216 | 2026-04-12 | |||
| CY7C136-55NXC | CYPRESS/赛普拉斯 | QFP | 12 | 192 | 2026-04-12 | |||
| KFG2G16Q2B-HEB8 | SAMSUNG/三星 | BGA | 12 | 3840 | 2026-04-12 | |||
| OB2268CPA | LITEON/光宝 | SOP8 | 06PB | 22500 | 2026-04-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAXM17532AMB+ | MAXIM/美信 | QFN | 1846 | 674 | 2026-04-12 | |||
| MAX6389XS29D2+T | MAXIM/美信 | SC70-4 | 2343 | 5000 | 2026-04-12 | |||
| MAX6389XS29D2+T | MAXIM/美信 | BGA | 2343 | 2500 | 2026-04-12 | |||
| TPS53312RGTR | TI/德州仪器 | QFN | 1036PB | 2933 | 2026-04-12 | |||
| BA6868FM-E2 | ROHM/罗姆 | HSOP28 | 12PB | 1500 | 2026-04-12 | |||
| NPH15S4803iC | MURATA/村田 | DIP | 16 | 3 | 2026-04-12 | |||
| NDTD1215C | MURATA/村田 | DIP | 1648/1642 | 5 | 2026-04-12 | |||
| MEF1S0505SP3C | MURATA/村田 | DIP | 16 | 120 | 2026-04-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX3522BCTN+ | MAXIM/美信 | QFN | 2426 | 516 | 2026-04-12 | |||
| LM2904PSR | TI/德州仪器 | SOP | 2010 | 2157 | 2026-04-12 | |||
| TS914ID | ST/意法 | SOP | 17 | 3171 | 2026-04-12 | |||
| INA240A2QPWRQ1 | TI/德州仪器 | TSSOP8 | 20 | 505 | 2026-04-04 | |||
| LM224DR | TI/德州仪器 | SOP14 | 20 | 66 | 2026-04-04 | |||
| LM258 | TI/德州仪器 | SOP8 | 20 | 135 | 2026-04-04 | |||
| RS722PXK | RUNIC/润石 | SOP8 | 20 | 2 | 2026-04-04 | |||
| OPA2171A | TI/德州仪器 | SOP8 | 20 | 174 | 2026-04-04 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UPD78F0515AGA-GAM-AX | RENESAS/瑞萨 | QFP48 | 16 | 600 | 2026-04-12 | |||
| UPD78F0034BGC-8BS-A | RENESAS/瑞萨 | QFP | 06 | 550 | 2026-04-12 | |||
| S29AL004D70TFI020H | SPANSION/飞索半导体 | TSSOP | 10 | 850 | 2026-04-12 | |||
| UPD78F0501MC(T)-5A4-A | NEC/日电电子 | TSSOP30 | 08 | 50400 | 2026-04-12 | |||
| TC358743XBG | TOSHIBA/东芝 | BGA | 17 | 465 | 2026-04-12 | |||
| MM74HC02N | FAIRCHILD/仙童 | DIP14 | 2001 | 450 | 2026-04-12 | |||
| MB9AF112KPMC-G-JNE2 | CYPRESS/赛普拉斯 | QFP | 15+ | 10 | 2026-04-12 | |||
| UPD78F0411GA-GAM-AX | RENESAS/瑞萨 | QFP | 20+ | 57933 | 2026-04-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX35103EHJ+T | MAXIM/美信 | QFP | 2427 | 1060 | 2026-04-12 | |||
| MAX9610FEXK+T | MAXIM/美信 | SC70-5 | 23 | 2500 | 2026-04-12 | |||
| ISO1I811T | INFINEON/英飞凌 | SSOP | 12+ | 2000 | 2026-04-12 | |||
| MAX4376FAUK/V+T | MAXIM/美信 | SOP | 2022 | 72288 | 2026-04-04 | |||
| DS2465P+T | MAXIM/美信 | SOP | 1902 | 3347 | 2026-04-04 | |||
| MAX9268GCM/V+ | MAXIM/美信 | QFP | 1849 | 3986 | 2026-04-04 | |||
| MAX9921AUB/V+ | MAXIM/美信 | SOP | 1907 | 2455 | 2026-04-04 | |||
| CA-IS3052G | CHIPANALOG/川土微 | SOP8 | 20 | 16 | 2026-04-04 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NPH25S2415iC | MURATA/村田 | DIP | 1648 | 1 | 2026-04-12 | |||
| NMXD0515SOC | MURATA/村田 | DIP | 16+ | 7 | 2026-04-12 | |||
| RUW15SL12C | MURATA/村田 | DIP | 1635/1641 | 2 | 2026-04-12 | |||
| NPH10S2412EiC | MURATA/村田 | DIP | 1628/1635 | 3 | 2026-04-12 | |||
| NCS12S1203C | MURATA/村田 | DIP | 1641/1632 | 13 | 2026-04-12 | |||
| NDS6D2415C | MURATA/村田 | DIP | 16+ | 8 | 2026-04-12 | |||
| NCS6S4812C | MURATA/村田 | DIP | 16 | 4 | 2026-04-12 | |||
| NCM6D0515EC | MURATA/村田 | DIP | 1642 | 6 | 2026-04-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| S29PL127J60BFI000 | SPANSION/飞索半导体 | BGA | 14 | 125 | 2026-04-12 | |||
| CY8C4025LQI-S412 | CYPRESS/赛普拉斯 | QFP | 16 | 100 | 2026-04-12 | |||
| S29GL256P90TFIR20 | SPANSION/飞索半导体 | QFP | 18 | 91 | 2026-04-12 | |||
| GL128S90DHI01 | SPANSION/飞索半导体 | BGA | 18 | 12001 | 2026-04-12 | |||
| PIC18F66J10-I/PT | MICROCHIP/微芯 | QFP | 20+ | 993 | 2026-04-12 | |||
| PIC18F44J10-I/PT | MICROCHIP/微芯 | QFP | 11+ | 535 | 2026-04-12 | |||
| S29GL032N90TAI030 | CYPRESS/赛普拉斯 | QFP | 16+ | 10 | 2026-04-12 | |||
| ATMEGA169PV-8MU | ATMEL/爱特梅尔 | QFN | 1 | 17500 | 2026-04-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| BD63888MUV-E2 | ROHM/罗姆 | QFN | 20 | 379 | 2026-04-12 | |||
| A3906SESTR-T | ALLEGRO/美国埃戈罗 | QFN | 19 | 12000 | 2026-04-12 | |||
| MAX9320EUA+ | MAXIM/美信 | MSO8 | 1932 | 2500 | 2026-04-12 | |||
| RAA229004GNP#HA0 | RENESAS/瑞萨 | QFN | 19 | 2688 | 2026-04-12 | |||
| NCP303152MNTWG | ONSEMI/安森美 | QFN5X6 | 22 | 119 | 2026-04-12 | |||
| NCP303150MNTWG | ONSEMI/安森美 | QFN5X6 | 22 | 180 | 2026-04-12 | |||
| NCP302155AMNTWG | ONSEMI/安森美 | QFN5X5 | 22 | 1578 | 2026-04-12 | |||
| SIC654CD-T1-GE3 | VISHAY/威世 | QFN5X5 | 22 | 113 | 2026-04-12 |